Phone Whos the real manufacturer It isnt AppleWho makes the i. Phone If you answered Apple, youre wrong. NCR_ATM.JPG' alt='Javelin Pos Installation Service' title='Javelin Pos Installation Service' />The i. Phone is a global effort. Tens of thousands of people at more than 3. Apples first phone possible. Apple, of course, designs the product, and also created the single most important component the software that gives the i. Phone its unique personality. But, while Apple gets the credit, behind the scenes there are a host of other players, each of which has to build and deliver complex parts on schedule to make the i. Phone possible. Some of them are well known names, like US based Intel, which supplies the NOR flash chips which hold the i. Phones updatable system software and Koreas Samsung, which makes the video processor IC. Two famous names from consumer electronics, Japans Sharp and Sanyo Epson, are among the suppliers of the phones bright 3. Unknown suppliers. Then there are the unknowns, each of which plays a small but vital role. Ever heard of Balda AGChinese factories owned by this German firm make the touch sensitive modules which are fixed onto the i. Phones LCD to make its innovative multi touch control possible. Its also Baldas technology which allowed Apple to switch to a tough scratch resistant glass screen, to avoid the complaints over scratching that tainted the i. Pod Nano launch. Another low profile firm, the UKs Cambridge Silicon Radio CSR, is the creator of the i. Phones Bluetooth module, in a deal that reportedly earns the integrated circuit design house 1. Phone made. You might have heard of the companies behind a few of the other i. Phone chips if youve ever wrestled with network driver installation on a PC. Marvell designs the Wi. Fi chip, for example. Broadcom, best known for its networking chips, is the company behind the specialized interface chip that interprets the movement of your fingers on the multitouch screen. While these chips are designed in Europe or the US, most of them arent made there. Instead they are rolling off production lines in Asia, from companies like Taiwan Semiconductor Manufacturing Co TSMC, undoubtedly the worlds biggest unknown chip maker, or its slightly smaller rival, United Microelectronic Corp UMC both companies are based in Taiwan. The distinctive aluminum and stainless steel i. Phone case is also made by a Taiwanese firm, Catcher Technology, according to analysts in Taiwan. NTAwWDUwMA==/z/gJUAAOxy63FSslij/$_3.JPG?set_id=2' alt='Javelin Pos Installation Service' title='Javelin Pos Installation Service' />Final assembly mystery. No matter where the i. Phones myriad components are made, they all end up in one place the factories of a lead contractor whose identity is now something of a mystery. Apples i. Pod manufacturing partner, Taiwans Foxconn, was long rumored to be the company that assembled the hundreds of components into a sleek i. Phone. However, Foxconns CEO recently surprised investors by telling them that these reports were incorrect, according to Reuters. Another likely Taiwanese candidate, Quanta, is rumored to be working on the i. Phone, but only on the next generation, so called i. Phone 2. 0. Analysts in Foxconns home base of Taipei however, still confidently list Foxconn International Holdings as the i. Phones assembler, despite the company CEOs apparent denial. Whoever the assembler is, it is there that the chips are planted onto printed circuit boards supplied by Taiwans Unimicron Technology Corp. THE POLISH NAVY 1918 1945 A Short Story Jack Ensign Stern Shield Introduction. History. Before Thalys, there had been an express rail service between Paris and Brussels since 1924 on the train service ltoile du Nord. In the 1970s it connected. Shop online and read reviews for MEIZU M3 Note Dual SIM Smartphone 3GB RAM, 32GB Storage Grey 2 Years Warranty M681H32GBGrey at PBTech. 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Javelin Pos Installation Service' title='Javelin Pos Installation Service' />Then all the components are fitted into the metal and plastic case to make a completed i. Phone, ready for shipment to the US. A second 3. G i. Phone During recent months, sources at a few of the component manufacturers named in this article have told regional media that Apple appears to be working on two different i. Phone designs. The key feature attributed to i. Phone 2. 0 is 3. G, as well as the GSM standard supported by the original i. Phone. At least one of the smaller components suppliers has reportedly already delivered parts for this forthcoming product. Phone Primary Contractors  a partial list. Software and design Apple. USAAssembly Foxconn, Quanta, Unknown. Taiwan TFT LCD Screen. Sanyo Epson, Sharp, TMDJapan Video processor chip Samsung. Korea Touch screen overlay Balda. Germany Bluetooth chip. Cambridge Silicon Radio. UKChip manufacture. TSMC, UMCTaiwan Baseband IC. Infineon Technology. Germany WIFI Chip. Marvell. USA Touch screen control chip. Broadcom. USA CMOS chip. Micron. USA NOR Flash ICs Intel, SSTUSA Display Driver chip. National Semi, Novatek. US, TW Case, Mechanical parts. Catcher, Foxconn Tech. Taiwan Camera lens. Largan Precision. Taiwan Camera module. Altus Tech, Primax, Lite On. Taiwan Battery Charger. Delta Electronics. Taiwan Timing Crystal. TXCTaiwan Passive components. Cyntec. Taiwan Connector and cables. Cheng Uei, Entery. Taiwan. Note This article is based on information supplied by KGI Securities, CLSA Asia Pacific, published media reports, and other sources in Asia. Update June 3. 0 Some of the first i. Phones sold have been dismantled, and more information about components is emerging. For example, i. Fixit identifies Samsung as the manufacturer of the main NAND flash chips, and Sky. Works as the designer of the mobile radio amplifier. Think Secret has also carried out an i. Phone teardown in the linked photo the large chip at the bottom of the shot is the Samsung flash chip. Buy the Gigabyte GA Z2. HD3 ATX Form Factor 4x DDR4 up to 3. MHz, HDMI DVI D. GA Z2. HD3 online. CPUSupport for 7th and 6th generation Intel Core i. Intel Core i. 5 processorsIntel Core i. Intel Pentium processorsIntel Celeron processors in the LGA1. L3 cache varies with CPUPlease refer CPU Support List for more information. Chipset. Intel Z2. Express Chipset. Memory. DDR4 DIMM sockets supporting up to 6. GB of system memory Due to a Windows 3. GB of physical memory is installed, the actual memory size displayed will be less than the size of the physical memory installed. Dual channel memory architecture. Support for DDR4 3. O. C. 3. 80. 0O. C. O. C. 3. 66. 6O. C. O. C. 3. 46. 6O. C. O. C. 3. 33. 3O. C. O. C. 3. 20. 0O. C. O. C. 2. 80. 0O. C. O. C. 2. 40. 0O. C. MHz memory modules. Support for ECC Un buffered DIMM 1. Rx. 82. Rx. 8 memory modules operate in non ECC modeSupport for non ECC Un buffered DIMM 1. Rx. 82. Rx. 81. Rx. Support for Extreme Memory Profile XMP memory modulesPlease refer Memory Support List for more information. Onboard Graphics. Integrated Graphics Processor Intel HD Graphics support 1 x D Sub port, supporting a maximum resolution of 1. Hz. 1 x DVI D port, supporting a maximum resolution of 1. HzThe DVI D port does not support D Sub connection by adapter. HDMI port, supporting a maximum resolution of 4. HzSupport for HDMI 1. Support for up to 3 displays at the same time. Maximum shared memory of 1 GBAudio. Realtek ALC8. 87 codec. High Definition Audio. Support for SPDIF Out. LANIntel Gb. E LAN chip 1. MbitExpansion Slots. PCI Express x. 16 slot, running at x. PCIEX1. 6For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX1. PCI Express x. 16 slots, running at x. PCIEX41, PCIEX422 x PCI Express x. All of the PCI Express slots conform to PCI Express 3. PCI slot. Multi Graphics Technology. Support for AMD Quad GPU Cross. Fire. X and 2 Way AMD Cross. Fire technologies PCIEX1. PCIEX41Storage Interface. Chipset 1 x M. 2 connector Socket 3, M key, type 2. SATA and PCIe x. 4x. SSD support1 x SATA Express connector. SATA 6. Gbs connectors. Support for RAID 0, RAID 1, RAID 5, and RAID 1. Refer to 1 7 Internal Connectors, for the installation notices for the M. SATA connectors. USBChipset 8 x USB 3. Gen 1 ports 4 ports on the back panel, 4 ports available through the internal USB headers6 x USB 2. USB headersInternal IO Connectors. ATX main power connector. ATX 1. 2V power connector. M. 2 Socket 3 connector. SATA Express connector. SATA 6. Gbs connectors. CPU fan header. 3 x system fan headers. SPDIF Out header. USB 3. 1 Gen 1 headers. USB 2. 01. 1 headers. Trusted Platform Module TPM header. Clear CMOS jumper. Back Panel Connectors. PS2 keyboardmouse port. D Sub port. 1 x DVI D port. HDMI port. 4 x USB 3. Gen 1 ports. 2 x USB 2. RJ 4. 5 port. 6 x audio jacks CenterSubwoofer Speaker Out, Rear Speaker Out, Side Speaker Out, Line In, Line Out, Mic InIO Controlleri. Lemmings Game For Windows Xp. TE IO Controller Chip. HW Monitoring. Voltage detection. Temperature detection. Fan speed detection. Overheating warning. Fan fail warning. Fan speed controlWhether the fan speed control function is supported will depend on the cooler you install. BIOS2 x 6. 4 Mbit flash. Use of licensed AMI UEFI BIOSSupport for Dual. BIOSPn. P 1. 0a, DMI 2. Wf. M 2. 0, SM BIOS 2. ACPI 5. 0. Unique Features. Support for APP CenterAvailable applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. D OSDBIOSAmbient LEDAuto. Green. BIOS Setup. Color Temperature. Cloud Station. Easy. Tune. Easy RAIDFast Boot. Game Boost. ONOFF Charge. Platform Power Management. Smart Backup. Smart Keyboard. Smart Time. Lock. System Information Viewer. USB Blocker. V Tuner. Support for 3. TB Unlock. Support for Q Flash. Support for Xpress Install. Bundle Software. Norton Internet Security OEM versionIntel Optane Memory Readyc. Fos. Speed. Operating System. Support for Windows 1. Support for Windows 7 3. Operating systems supported may vary depending on your processor model. Please download the Windows USB Installation Tool from GIGABYTEs website and install it before installing Windows 7. Form Factor. ATX Form Factor 3.